Call For Papers


The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world to exchange innovative ideas on system, board, and device testing with design, manufacturing, and field consideration in mind.


Topics of interest include (but are not limited to):

  • Analog/Mixed-Signal Test
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Connectivity Testing
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DFT)
  • Diagnosis and Silicon Debug
  • Economic of Test
  • Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • GPU Test
  • Hardware-Oriented Security and trust
  • High-Speed I/O Test
  • Low-Power IC Test
  • Machine Learning in Test
  • Memory Test and Repair
  • Multi-/Many-core Processor Test
  • Online Test
  • Power/Thermal/Reliability Issues in Test
  • Reconfigurable System Test
  • RF Test
  • Self-Repair
  • SiP, Stacked, 3D IC Test
  • Standards in Test
  • Test Compression
  • Test for Biomedical Circuits and Systems
  • Test for MEMS and Microfluidic Systems
  • Test for Nanoscale Devices and Emerging Technologies
  • Test for Reversible and Quantum Circuits
  • Test for Sensors and IoT
  • Test Quality
  • Test Synthesis
  • Validation and Verification
  • Yield Analysis and Enhancement

Regular Sessions

The ATS ’21 Organizing Committee invites original, unpublished paper submissions on the above topics. Paper submission shall be complete manuscripts, not exceeding six pages in a standard IEEE two-column format. The submission will be considered evidence that upon acceptance the author(s) will submit a final camera-ready version of the paper for inclusion in the proceedings, and will present the paper at the symposium. Each accepted contribution must have at least one full paid registration by the time the camera ready paper is submitted for inclusion in the proceedings. ATS reserves the right to remove from IEEE Xplore papers not presented at the symposium.

Industry Session

This session will address a wide range of practical problems in LSI test, board and system test, diagnosis, failure analysis, design verification, and so on. A one-page abstract is required for submission. Each submission should also include the complete address and designate a contact person and a presenter. Abstract submissions should be emailed to Industry Chair (e-mail: ats2021ic [at]

Paper Submission

All submission should be made electronically in PDF format at ( A submission should contain a complete manuscript within a limit of 6 pages in 10-point single-spaced double-column format, and an abstract of 50–200 words. The paper must be submitted for a single blind review process. Once a submission is accepted, the author(s) must prepare the final camera-ready manuscript in time for inclusion in the proceedings, and present the paper at the symposium. In case of any difficulty in submission, authors may contact
ats2021ogmember [at]

Key Dates

Submission deadline (PDF paper): June 19, 2021 (Extended Further!) June 2, 2021 (Extended) May 23, 2021 (June 23, 2021 for Industry Session)
Notification of acceptance: August 6, 2021 July 29, 2021
Camera-ready manuscript: September 7, 2021 August 31, 2021